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The new facility — home to an advanced semiconductor packaging production line that will mass-produce next-generation high-bandwidth memory, or HBM, chips, the critical component of graphic processing units that train AI systems such as ChatGPT — is expected to provide more than a thousand new employment opportunities in the Greater Lafayette community. The company plans to begin mass production in the second half of 2028.
The project marks SK hynix’s intention for long-term investment and partnership in Greater Lafayette. The company’s decision-making framework prioritizes both profit and social responsibility while promoting ethical actions and accountability.
From infrastructure developments that make accessing amenities easier to community empowerment projects such as skill development and mentorship, the SK hynix advanced packaging fabrication marks a new era of collaborative growth.
“Indiana is a global leader in innovating and producing the products that will power our future economy, and today’s news is proof positive of that fact,” said Indiana Gov. Eric Holcomb. “I’m so proud to officially welcome SK hynix to Indiana, and we’re confident this new partnership will enhance the Lafayette-West Lafayette region, Purdue University and the state of Indiana for the long term.
This new semiconductor innovation and packaging plant not only reaffirms the state’s role in the hard-tech sector, but is also another tremendous step forward in advancing U.S. innovation and national security, putting Hoosiers at the forefront of national and global advancements.”
Investment in the Midwest and Indiana was spurred by Purdue’s excellence in discovery and innovation and its track record of exceptional R&D and talent development through collaboration. Partnerships among Purdue, the corporate sector, and the state and federal government are essential to advancing the U.S. semiconductor industry and establishing the region as the Silicon Heartland.