SCHMID Group Takes Next Step Towards Advanced Packaging for Integrated Circuits with Glass Cores

 

Glass cores have the advantage of offering the required planarity and thermal stability to enable the required size reduction and layer-to-layer registration accuracy. However, this accuracy needs to be matched be the layer build up technology, too. The SCHMID ET process is the next generation of sequential build up production technology, offering not only a planar surface for each layer, but also the access to a new via formation, that does not use laser drilling, which in-return provides miniaturization of materials with much higher resilience and tolerance, as well as signal integrity capabilities.

 

The new SCHMID glass core substrate lab also includes the machine platforms that guide the SCHMID process to realize the next generation of ABF (Ajinomoto Build Up Films) based fan out.

 

“Depending on the final IC package, the material selection and process a customer could need may differ. Speed and process flexibility are now the main crucial elements to success,” explains Christian Schmid, CEO of the SCHMID Group, further adding, “Our SCHMID lab & pilot solution offers both and enables our customers to scale for high volume production quickly.”

 

Together with partners, SCHMID is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass substrate into an advanced IC package.

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